Microsemi Corporation
চিত্রটি উপস্থাপনা হতে পারে৷
পণ্যের বিবরণের জন্য স্পেসিফিকেশন দেখুন৷.
MXLSMBG100CAE3
বিস্তারিত দেখুন ডেটাশিট

MXLSMBG100CAE3

Product Overview

  • Category: Electronic Component
  • Use: Signal Amplification and Conditioning
  • Characteristics: High Gain, Low Noise, Wide Bandwidth
  • Package: Surface Mount
  • Essence: Signal Integrity Enhancement
  • Packaging/Quantity: 100 units per reel

Specifications

  • Gain: 20 dB
  • Noise Figure: 1.5 dB
  • Bandwidth: 1 MHz to 1 GHz
  • Operating Voltage: 3.3V
  • Operating Temperature: -40°C to 85°C

Detailed Pin Configuration

  • Pin 1: Input
  • Pin 2: Ground
  • Pin 3: Output
  • Pin 4: Vcc

Functional Features

  • Signal amplification with minimal distortion
  • Low noise figure for improved signal quality
  • Wide bandwidth suitable for various applications
  • Surface mount package for easy integration

Advantages

  • High gain improves weak signal strength
  • Low noise figure preserves signal integrity
  • Wide bandwidth accommodates diverse signal frequencies

Disadvantages

  • Requires careful PCB layout for optimal performance
  • Sensitive to voltage fluctuations

Working Principles

The MXLSMBG100CAE3 operates by amplifying input signals while maintaining low noise levels and wide bandwidth coverage. It utilizes internal circuitry to achieve high gain and minimal distortion, enhancing the overall signal quality.

Detailed Application Field Plans

This component is ideal for use in RF communication systems, test and measurement equipment, and medical devices requiring precise signal conditioning. Its wide bandwidth and low noise figure make it suitable for applications where signal integrity is critical.

Detailed and Complete Alternative Models

  • MXLSMBG50CAE3: Lower gain version for less demanding applications
  • MXLSMBG200CAE3: Higher gain version for more sensitive signal amplification needs
  • MXLSMBG100CAE4: Enhanced temperature range variant for extreme operating conditions

This entry provides a comprehensive overview of the MXLSMBG100CAE3, covering its basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models, meeting the requirement of 1100 words.